BE Semiconductor Industries N.V. (BESI.AS)

139,15 +4,00 (+2,96%) Al cierre: 05:35PM CEST

BE Semiconductor Industries N.V.

Ratio 6
Duiven 6921 RW
Netherlands
31 26 319 4500
https://www.besi.com

Sector(es): Technology
Sector: Semiconductor Equipment & Materials
Empleados a tiempo completo: 1760

Ejecutivos clave

Nombre	Título	Paga	Ejecutado	Año de nacimiento
Mr. Richard W. Blickman	Chairman of Management Board, President & CEO	1,88M	N/A	1954
Mr. Leon Verweijen	Senior Vice President of Finance	N/A	N/A	1976
Mr. Henk-Jan Jonge Poerink	Senior Vice President of Global Operations	N/A	N/A	1970
Mr. Chris Scanlan	Senior Vice President of Technology	N/A	N/A	1969
Edmond Franco	Vice President of Corporate Development	N/A	N/A	N/A
Mr. Rene W. Hendriks	Senior Vice President of Sales - North America & Europe	N/A	N/A	1961
Mr. Peter Wiedner	Senior Vice President of Sub Micron Die Attach	N/A	N/A	1970
Mr. Jong Kwon Park	Senior Vice President of Sales & Customer Support - APAC	N/A	N/A	1966
Mr. Jeroen Kleijburg	Senior Vice President of Packaging	N/A	N/A	1974
Mr. Christoph Scheiring	Senior Vice President of Die Attach	N/A	N/A	1970

Los importes son a partir de 31 de diciembre de 2023 y los valores de compensación son para el último año fiscal que finaliza en esa fecha. Paga es el salario, las bonificaciones, etc. Ejecutado es el valor de las opciones ejecutadas durante el año fiscal. Divisa en EUR.

Descripción

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company's principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

Gobierno corporativo

El ISS Governance QualityScore de BE Semiconductor Industries N.V., a día 1 de mayo de 2024, es 2. Las puntuaciones base son Auditoría: 6; Tablero: 1; Derechos de los accionistas: 5; Compensación: 2.

Puntuación de gobierno corporativo cedida por Institutional Shareholder Services (ISS). Las puntuaciones indican un rango decil relativo al índice o región. Una puntuación decil de 1 indica un menor riesgo de gobierno, mientras que un 10 indica un riesgo de gobierno superior.