China Wafer Level CSP Co., Ltd. (603005.SS)

18,63 -0,14 (-0,75%) Al cierre: 03:00PM CST

China Wafer Level CSP Co., Ltd.

Suzhou Industrial Park
No.29 Tinglan Lane
Suzhou 215026
China
86 512 6773 0001
https://www.wlcsp.com

Sector(es): Technology
Sector: Semiconductors
Empleados a tiempo completo: 861

Ejecutivos clave

Nombre	Título	Paga	Ejecutado	Año de nacimiento
Mr. Jiaguo Duan	Board Secretary & Treasurer	N/A	N/A	1980
Mr. Vage Oganesian	Deputy GM & Director	N/A	N/A	1970
Mr. Hongjun Liu	Deputy General Manager	N/A	N/A	1971
Mr. Xingxin Yang	Deputy General Manager	N/A	N/A	1971
Mr. Wei Wang	Chairman of the Board, Chief Executive Officer, President and General Manager	N/A	N/A	1967
Ms. Zhi Hua Liu	Financial Manager & Supervisor	N/A	N/A	1973
Mr. Xiaoqing Qian	Deputy General Manager	N/A	N/A	1983
Mr. Qiang Gu	Deputy General Manager	N/A	N/A	1966

Los importes son a partir de y los valores de compensación son para el último año fiscal que finaliza en esa fecha. Paga es el salario, las bonificaciones, etc. Ejecutado es el valor de las opciones ejecutadas durante el año fiscal. Divisa en CNY.

Descripción

China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers CIS chips, TOF chips, image sensor chips, biometric identification chips, and MEMS chips and related products are widely used in smart phones, security monitoring digital, automotive electronics, identification, and other fields. The company also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.

Gobierno corporativo

El ISS Governance QualityScore de China Wafer Level CSP Co., Ltd., a día N/A, es N/A. Las puntuaciones base son Auditoría: N/A; Tablero: N/A; Derechos de los accionistas: N/A; Compensación: N/A.

Puntuación de gobierno corporativo cedida por Institutional Shareholder Services (ISS). Las puntuaciones indican un rango decil relativo al índice o región. Una puntuación decil de 1 indica un menor riesgo de gobierno, mientras que un 10 indica un riesgo de gobierno superior.