ASE Technology Holding Co., Ltd. (ASX)

7,20 -0,17 (-2,31%) Al cierre: 04:00PM EST

ASE Technology Holding Co., Ltd.

26, Chin 3rd Road
Nanzih District
Kaohsiung 811
Taiwan
886 7 361 7131
https://www.aseglobal.com

Sector(es): Technology
Sector: Semiconductors
Empleados a tiempo completo: 99.104

Ejecutivos clave

Nombre	Título	Paga	Ejecutado	Año de nacimiento
Mr. Hung-Pen Chang	Vice Chairman, GM & Pres	N/A	N/A	1947
Mr. Joseph Tung	Group CFO & Representative Director	N/A	N/A	1959
Dr. Tien Yu Wu	Group COO & Representative Director	N/A	N/A	1958
Mr. Murphy Kuo	Sr. VP, Accountant Mang. & Group Controller	N/A	N/A	N/A
Mr. Du-Tsuen Uang	Chief Admin. Officer, Chief Corp. Governance Officer & Company Sec.	N/A	N/A	1960
Mr. Kenneth Hsiang	Head of Investor Relations & VP	N/A	N/A	1971
Dr. Shi Hua Pan	Group Chief of Staff	N/A	N/A	1945
Mr. Rui Rong Lo	GM of Kaohsiung Plant & Representative Director	N/A	N/A	1955
Mr. Kwai Mun Lee	Pres of Southeast Asia Operations	N/A	N/A	1963
Mr. Bo-Lian Li	Sr. VP	N/A	N/A	N/A

Los importes son a partir de 31 de diciembre de 2016 y los valores de compensación son para el último año fiscal que finaliza en esa fecha. Paga es el salario, las bonificaciones, etc. Ejecutado es el valor de las opciones ejecutadas durante el año fiscal. Divisa en USD.

Descripción

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

Gobierno corporativo

El ISS Governance QualityScore de ASE Technology Holding Co., Ltd., a día N/A, es N/A. Las puntuaciones base son Auditoría: N/A; Tablero: N/A; Derechos de los accionistas: N/A; Compensación: N/A.

Puntuación de gobierno corporativo cedida por Institutional Shareholder Services (ISS). Las puntuaciones indican un rango decil relativo al índice o región. Una puntuación decil de 1 indica un menor riesgo de gobierno, mientras que un 10 indica un riesgo de gobierno superior.